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스퍼터링 증착 서비스 메뉴
MenuMaterialsFilm
Thickness
Substrate
Common Metals Cu, Ti, Cr, Ni, Al, Si, Ru, Ta, W, Mo Typical thickness :
< 1 um

(The film thickness over 1 um is also possible according to film materials. Hence, please, ask us before request.)
Type:
- Si wafers
- Single crystals
- Glasses
- Ceramics
- Metal plates
- Plastics, etc.

Size:
- (max) dia: 8 inches (200 mm)
- A piece of substrate also   possible
Noble MetalsAu, Ag, Pt, Pd
NitridesTiN, TaN
OxidesSiO2, TiO2, Ta2O5, RuO2, NiO
Other MaterialsNiCr, Ta-SiO2

Pt 박막
TypeCrystallographic
Orientation of Pt
Thickness (nm)Si Wafer
(Substrate)
SiO2Glue layerPt
1Pt/SiO2/Si(111)300none150 P-type (100)
2(200)300none150
3Pt/Ti/SiO2/Si(111)30010150
4Pt/TiO2/SiO2/Si(111)30020150
5(200)30020150
 
Au 박막
TypeThickness (nm)SubstrateApplication
AuGlue
1Au/Cr435대부분의 기판에
증착 가능함
MEMS 소자,
Piezo소자,
전극패드
15010
2Au/NiCr/Ti200500/400
 
Cu 박막
TypeThickness (nm)SubstrateApplication
CuGlue
1Cu/Ti500200대부분의 기판에
증착 가능함
MEMS 소자,
Cu 도금 공정을
위한 Cu 씨앗층
2300100